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    Global Shipping
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    Business customers
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    25+ years experience
    Founded in 1992 to target the emerging mobile computing market, Clove Technology has grown and adapted into what you see today.

    Staffed by a small, yet dedicated team, product knowledge and customer service have been paramount to our continued success for nearly 3 decades.

    Whether you plan on buying a £1,000 smartphone or a £10 case, for delivery down the road or to the other side of the world, we're here to answer any questions you might have.
    25+ Years experience
    Founded in 1992
    Intel Core i9-10940X Processor 3.3 GHz 19.25 MB Smart Cache Box

    Intel Core i9-10940X Processor 3.3 GHz 19.25 MB Smart Cache Box

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    GLOBAL SHIPPING – UPS & DHL
    BUSINESS CUSTOMERS – please email: Sales@clove.co.uk
    FAST SHIPPING – All orders

    Intel Core i9-10940X Processor 3.3 GHz 19.25 MB Smart Cache Box


    Key Features

    • Processor Family: Intel Core i9 X-series
    • Processing Socket: LGA 2066 (Socket R4)
    • Number of Cores: 14
    • Graphics Type: No On-Board Graphics
    • Cooling: Cooler Not Included
    • Boxed?: Boxed

    Overview

    Intel® Optane™ Memory Supported Intel® Optane™ memory is a revolutionary new class of non-volatile memory that sits in between system memory and storage to accelerate system performance and responsiveness. When combined with the Intel® Rapid Storage Technology Driver, it seamlessly manages multiple tiers of storage while presenting one virtual drive to the OS, ensuring that data frequently used resides on the fastest tier of storage. Intel® Optane™ memory requires specific hardware and software configuration. Intel® Turbo Boost Technology Intel® Turbo Boost Technology dynamically increases the processor's frequency as needed by taking advantage of thermal and power headroom to give you a burst of speed when you need it, and increased energy efficiency when you don’t. Intel® Hyper-Threading Technology Intel® Hyper-Threading Technology (Intel® HT Technology) delivers two processing threads per physical core. Highly threaded applications can get more work done in parallel, completing tasks sooner. Intel® Virtualization Technology (VT-x) Intel® Virtualization Technology (VT-x) allows one hardware platform to function as multiple “virtual” platforms. It offers improved manageability by limiting downtime and maintaining productivity by isolating computing activities into separate partitions. Intel® Virtualization Technology for Directed I/O (VT-d) Intel® Virtualization Technology for Directed I/O (VT-d) continues from the existing support for IA-32 (VT-x) and Itanium® processor (VT-i) virtualization adding new support for I/O-device virtualization. Intel VT-d can help end users improve security and reliability of the systems and also improve performance of I/O devices in virtualized environments. Intel® 64 Intel® 64 architecture delivers 64-bit computing on server, workstation, desktop and mobile platforms when combined with supporting software.¹ Intel 64 architecture improves performance by allowing systems to address more than 4 GB of both virtual and physical memory. Instruction Set An instruction set refers to the basic set of commands and instructions that a microprocessor understands and can carry out. The value shown represents which Intel’s instruction set this processor is compatible with. Instruction Set Extensions Instruction Set Extensions are additional instructions which can increase performance when the same operations are performed on multiple data objects. These can include SSE (Streaming SIMD Extensions) and AVX (Advanced Vector Extensions). # of AVX-512 FMA Units Intel® Advanced Vector Extensions 512 (AVX-512), new instruction set extensions, delivering ultra-wide (512-bit) vector operations capabilities, with up to 2 FMAs (Fused Multiply Add instructions), to accelerate performance for your most demanding computational tasks. Enhanced Intel SpeedStep® Technology Enhanced Intel SpeedStep® Technology is an advanced means of enabling high performance while meeting the power-conservation needs of mobile systems. Conventional Intel SpeedStep® Technology switches both voltage and frequency in tandem between high and low levels in response to processor load. Enhanced Intel SpeedStep® Technology builds upon that architecture using design strategies such as Separation between Voltage and Frequency Changes, and Clock Partitioning and Recovery. Intel® Deep Learning Boost (Intel® DL Boost) A new set of embedded processor technologies designed to accelerate AI deep learning use cases. It extends Intel AVX-512 with a new Vector Neural Network Instruction (VNNI) that significantly increases deep learning inference performance over previous generations.

    Processor
    Processor generation 10th gen Intel® Core™ i9
    Processor base frequency 3.3 GHz
    Processor manufacturer Intel
    Cooler included No
    Processor codename Cascade Lake
    Memory bandwidth supported by processor (max) 94 GB/s
    Thermal Design Power (TDP) 165 W
    Processor cache 19.25 MB
    Processor ARK ID 198014
    Processor model i9-10940X
    Processor threads 28
    System bus rate 8 GT/s
    Processor operating modes 64-bit
    Processor boost frequency 4.6 GHz
    Component for PC
    Processor lithography 14 nm
    Processor family Intel® Core™ i9 X-series
    Processor cores 14
    Box Yes
    Processor socket LGA 2066 (Socket R4)
    Processor cache type Smart Cache
    Generation 10th Generation
    Memory
    Maximum internal memory supported by processor 256 GB
    Memory types supported by processor DDR4-SDRAM
    Memory clock speeds supported by processor 2933 MHz
    Memory bandwidth supported by processor (max) 94 GB/s
    Supported memory types DDR4-SDRAM
    Memory channels Quad-channel
    ECC No
    Graphics
    Discrete graphics card No
    On-board graphics card model Not available
    On-board graphics card No
    Discrete graphics card model Not available
    Power
    Thermal Design Power (TDP) 165 W
    Technical details
    Thermal solution specification PCG 2017X
    Intel® Turbo Boost Technology 2.0
    Intel® Hyper Threading Technology (Intel® HT Technology) Yes
    Intel® AES New Instructions (Intel® AES-NI) Yes
    Execute Disable Bit Yes
    Enhanced Intel SpeedStep Technology Yes
    PCI Express slots version 3.0
    Supported instruction sets SSE4.1, SSE4.2, AVX 2.0, AVX-512
    Scalability 1S
    Embedded options available No
    CPU configuration (max) 1
    Product type Processor
    Intel Virtualization Technology for Directed I/O (VT-d) Yes
    Intel 64 Yes
    Thermal Design Power (TDP) 165 W
    Supported memory types DDR4-SDRAM
    Status Launched
    Market segment Desktop
    Launch date Q4'19
    Intel Virtualization Technology (VT-x) Yes
    Processor cache type Smart Cache
    Maximum memory 256 GB
    AVX-512 Fused Multiply-Add (FMA) units 2
    Bus speed 8 GT/s DMI3
    Target market Gaming, Content Creation
    Features
    Maximum number of PCI Express lanes 48
    Thermal Design Power (TDP) 165 W
    Processor ARK ID 198014
    Thermal solution specification PCG 2017X
    Execute Disable Bit Yes
    PCI Express slots version 3.0
    Supported instruction sets SSE4.1, SSE4.2, AVX 2.0, AVX-512
    Scalability 1S
    Embedded options available No
    CPU configuration (max) 1
    Market segment Desktop
    Harmonized System (HS) code 85423119
    Export Control Classification Number (ECCN) 5A992C
    Commodity Classification Automated Tracking System (CCATS) G077159
    PCI Express CEM revision 3.0
    Processor special features
    Intel Virtualization Technology for Directed I/O (VT-d) Yes
    Intel 64 Yes
    Intel Turbo Boost Max Technology 3.0 Yes
    Intel® Optane™ Memory Ready Yes
    Intel® Turbo Boost Technology 2.0
    Intel® Hyper Threading Technology (Intel® HT Technology) Yes
    Intel® AES New Instructions (Intel® AES-NI) Yes
    Enhanced Intel SpeedStep Technology Yes
    Intel Virtualization Technology (VT-x) Yes
    AVX-512 Fused Multiply-Add (FMA) units 2
    Intel® Deep Learning Boost (Intel® DL Boost) Yes
    Intel® Turbo Boost Max Technology 3.0 frequency 4.8 GHz
    Operational conditions
    Tjunction 86 °C
    Packaging data
    Package type Retail box
    Other features
    Maximum internal memory 256 GB
    CPU configuration (max) 1
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